P126020

Devcon HP 250 Epoxy

Devcon HP 250 Epoxy
  • Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
  • High-performance, gap-filling thixotropic paste for structural bonding applications
  • Superior toughness, impact- and chemical-resistant
HP 250 Epoxy, 50 mL, Dev-Pak, Straw
Devcon

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Devcon HP 250 Epoxy
Product Number Capacity Vol. Container Size Length Packing Type Width Color Adhesive Tensile Shear Viscosity Temp. Range Tensile Strength Fix Cure Time @ Temp. Full Cure Time @ Temp. Elongation Chemical Compound Hardness Height Working Time Applications Applicable Materials Price Quantity
230-14315 50 mL 50 mL 7 1/4 in Dev-Pak™ 6 in Straw 3200 psi 105000.0 cP -67.0 °F [Min], 250.0 °F [Max] 3200 psi 6 h @ 72 °F 7 d @ 72 °F 25 % Epoxy 78.0 Shore D 3 1/4 in 65 min Multi-Purpose Aluminum, Brass, Copper, Galvanized Steel, Most Metals, Steel
List Price: $21.82
TODAY: $19.64
Sold-As: 1
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