P126000

Devcon 5 Minute® Epoxy Gels

Devcon 5 Minute® Epoxy Gels
  • Fast curing for bond tags on machinery and equipment
  • Fills gaps to .25 inch
  • Good solvent resistance
  • High tensile strength
  • Non-sagging adhesive
  • Thixotropic, nonmigrating gel adhesive with excellent gap filling properties
5 Minute Epoxy Gels, 50 mL, Dev-Pak, Amber
Devcon

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Devcon 5 Minute® Epoxy Gels
Product Number Capacity Vol. Container Size Packing Type Color Gap Fill Adhesive Tensile Shear Viscosity Hardness Temp. Range Working Time Fix Cure Time @ Temp. Full Cure Time @ Temp. Chemical Compound Dielectric Strength Applications Applicable Materials Resistance Wt. quantity Price Quantity
230-14240 25 mL 25 mL Dual Syringe Tube Amber 1/4 in 1900 psi 150000.0 cP 80.0 Shore D -40.0 °F [Min], 200.0 °F [Max] 7 min, 4 min [Min], 7 min [Max] 1 h @ 75 °F 16 h @ 75 °F Epoxy 440.0 V/mil Multi-Purpose Aluminum, Most Metals, Steel, Wood, Concrete, Copper, Fabric, Ceramic, Ferrites Hydrochloric Acid 3%, Kerosene, Sulfuric Acid-10%, Toluene 0.15 lb
List Price: $9.59
TODAY: $8.63
Sold-As: 1
Not In Stock
230-14265 50 mL 50 mL Dev-Pak™ Amber 1/4 in 1900 psi 150000.0 cP 80.0 Shore D -40.0 °F [Min], 200.0 °F [Max] 4 min [Min], 7 min [Max] 1 h @ 75 °F 16 h @ 75 °F Epoxy 440.0 V/mil Multi-Purpose Aluminum, Ceramic, Concrete, Copper, Fabric, Ferrites, Most Metals, Steel, Wood Hydrochloric Acid 3%, Kerosene, Sulfuric Acid-10%, Toluene 0.20 lb 12 PER CS
List Price: $222.06
TODAY: $199.85
Sold-As: 12
Not In Stock

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