P126000
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Devcon 5 Minute® Epoxy Gels
- Fast curing for bond tags on machinery and equipment
- Fills gaps to .25 inch
- Good solvent resistance
- High tensile strength
- Non-sagging adhesive
- Thixotropic, nonmigrating gel adhesive with excellent gap filling properties
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Prices and Availability Subject to Change
Devcon 5 Minute® Epoxy Gels | |||||||||||||||||||||||
Product Number | Capacity Vol. | Container Size | Packing Type | Color | Gap Fill | Adhesive Tensile Shear | Viscosity | Hardness | Temp. Range | Working Time | Fix Cure Time @ Temp. | Full Cure Time @ Temp. | Chemical Compound | Dielectric Strength | Applications | Applicable Materials | Resistance | Wt. | quantity | Price | Quantity | ||
230-14240 | 25 mL | 25 mL | Dual Syringe Tube | Amber | 1/4 in | 1900 psi | 150000.0 cP | 80.0 Shore D | -40.0 °F [Min], 200.0 °F [Max] | 7 min, 4 min [Min], 7 min [Max] | 1 h @ 75 °F | 16 h @ 75 °F | Epoxy | 440.0 V/mil | Multi-Purpose | Aluminum, Most Metals, Steel, Wood, Concrete, Copper, Fabric, Ceramic, Ferrites | Hydrochloric Acid 3%, Kerosene, Sulfuric Acid-10%, Toluene | 0.15 lb |
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230-14265 | 50 mL | 50 mL | Dev-Pak™ | Amber | 1/4 in | 1900 psi | 150000.0 cP | 80.0 Shore D | -40.0 °F [Min], 200.0 °F [Max] | 4 min [Min], 7 min [Max] | 1 h @ 75 °F | 16 h @ 75 °F | Epoxy | 440.0 V/mil | Multi-Purpose | Aluminum, Ceramic, Concrete, Copper, Fabric, Ferrites, Most Metals, Steel, Wood | Hydrochloric Acid 3%, Kerosene, Sulfuric Acid-10%, Toluene | 0.20 lb | 12 PER CS |
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Not In Stock |