Devcon HP 250 Epoxy

• Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
• High-performance, gap-filling thixotropic paste for structural bonding applications
• Superior toughness, impact- and chemical-resistant

HP 250 Epoxy, 50 mL, Dev-Pak, Straw

Devcon HP 250 Epoxy

Product Number

Capacity Vol.

Container Size

Length

Packing Type

Width

Color

Adhesive Tensile Shear

Viscosity

Temp. Range

Tensile Strength

Fix Cure Time @ Temp.

Full Cure Time @ Temp.

Elongation

Chemical Compound

Hardness

Height

Working Time

Applications

Applicable Materials

Price

Quantity

230-14315

50 mL

50 mL

7 1/4 in

Dev-Pak™

6 in

Straw

3200 psi

105000.0 cP

-67.0 °F [Min], 250.0 °F [Max]

3200 psi

6 h @ 72 °F

7 d @ 72 °F

25 %

Epoxy

78.0 Shore D

3 1/4 in

65 min

Multi-Purpose

Aluminum, Brass, Copper, Galvanized Steel, Most Metals, Steel

List Price: $21.82 TODAY: $19.64 Sold-As: 1

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